Copper foil tau muab faib ua plaub pawg hauv qab no raws li qhov tuab:
Thickness ntawm tooj liab: ≥70μm
Cov ntawv tuab tooj liab: 18μm
Nyias tooj liab ntawv ci: 12μm
Ultra-thin tooj liab ntawv ci: Thickness <12μm
Ultra-thin tooj liab ntawv ci feem ntau yog siv hauv cov roj teeb lithium. Tam sim no, lub thickness ntawm lub ntsiab tooj liab ntawv ci nyob rau hauv Tuam Tshoj yog 6 μm, thiab cov zus tau tej cov kev kawm ntawm 4.5 μm yog accelerating. Lub thickness ntawm lub ntsiab tooj liab ntawv ci txawv teb chaws yog 8 μm, thiab tus nqi nkag ntawm ultra-thin tooj liab ntawv ci yog me ntsis qis dua li hauv Suav teb.
Vim muaj cov kev txwv ntawm lub zog siab ceev thiab kev ruaj ntseg siab ntawm cov roj teeb lithium, cov ntawv ci tooj liab kuj nce mus rau thinner, microporous, siab tensile zog thiab siab elongation.
Copper foil tau muab faib ua ob pawg hauv qab no raws li cov txheej txheem ntau lawm:
Electrolytic tooj liab ntawv ci yog tsim los ntawm depositing tooj liab ions nyob rau hauv lub electrolyte ntawm ib tug du rotating stainless hlau phaj (los yog titanium phaj) ncig cathode nruas.
Rolled tooj liab ntawv ci feem ntau yog ua los ntawm tooj liab ingots li raw cov ntaub ntawv, thiab yog ua los ntawm kub nias, tempering thiab toughening, scaling, txias dov, nruam toughening, pickling, calendering thiab degreasing thiab ziab.
Electrolytic tooj liab ntawv ci yog dav siv nyob rau hauv lub ntiaj teb no, vim hais tias nws muaj qhov zoo ntawm cov nqi ntau lawm thiab tsis tshua muaj kev pib. Nws yog tsuas yog siv nyob rau hauv tooj liab clad laminate PCB, FCP thiab lithium roj teeb ntsig txog teb, thiab nws kuj yog cov khoom tseem ceeb hauv kev ua lag luam tam sim no; kev tsim cov ntawv yob tooj liab Cov nqi thiab cov txheej txheem kev ua haujlwm siab, ua rau me me ntawm kev siv, feem ntau yog siv hauv cov tooj liab clad laminates.
Txij li thaum lub folding kuj thiab modulus ntawm elasticity ntawm dov tooj liab ntawv ci yog ntau dua li ntawm electrolytic tooj liab ntawv ci, nws yog haum rau saj zawg zog tooj liab clad boards. Nws cov purity tooj liab (99.9%) yog siab dua li ntawm electrolytic tooj liab ntawv ci (99.89%), thiab nws yog smoother tshaj electrolytic tooj liab ntawv ci rau ntawm qhov ntxhib nto, uas yog conducive rau lub ceev kis ntawm hluav taws xob teeb liab.
Cov cheeb tsam tseem ceeb ntawm daim ntawv thov:
1. Kev tsim khoom siv hluav taws xob
Copper foil tuav lub luag haujlwm tseem ceeb hauv kev tsim khoom siv hluav taws xob thiab feem ntau yog siv los tsim cov ntawv luam tawm Circuit Board (PCB / FPC), capacitors, inductors thiab lwm yam khoom siv hluav taws xob. Nrog rau kev txhim kho ntse ntawm cov khoom siv hluav taws xob, qhov kev thov rau cov ntawv ci tooj liab yuav nce ntxiv.
2. Hnub ci vaj huam sib luag
Hnub ci vaj huam sib luag yog cov cuab yeej siv hnub ci photovoltaic los hloov lub hnub ci zog rau hauv hluav taws xob. Nrog rau kev nthuav dav ntawm kev tiv thaiv ib puag ncig thoob ntiaj teb, qhov kev thov rau cov ntawv ci tooj liab yuav nce siab heev.
3. Automotive electronics
Nrog rau kev txhim kho ntse ntawm kev lag luam tsheb, nws tau nruab nrog ntau thiab ntau cov khoom siv hluav taws xob, uas ua rau muaj kev xav tau ntau ntxiv rau cov ntawv ci tooj liab.
Post lub sij hawm: Jun-26-2023