Feem ntau Ua tiav Copper Foil Classification

tooj liab ntawv cicov khoom siv tsuas yog siv hauv kev lag luam roj teeb lithium, radiator kev lag luamthiab PCB kev lag luam.

1.Electro deposited copper foil (ED copper foil) yog hais txog tooj liab ntawv ci ua los ntawm electrodeposition. Nws cov txheej txheem tsim khoom yog txheej txheem electrolytic. Lub cathode cov menyuam yuav nqus hlau tooj liab ions los ua cov ntawv ci electrolytic raw. Raws li cov cathode cov menyuam tig tsis tu ncua, cov ntawv ci tsim tawm tsis tu ncua absorbed thiab tev tawm ntawm cov menyuam. Tom qab ntawd nws yog ntxuav, qhuav, thiab qhov txhab nyob rau hauv ib tug yob ntawm raw ntawv ci.

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2.RA, Rolled annealed tooj liab ntawv ci, yog tsim los ntawm kev ua tooj liab ore rau hauv tooj liab ingots, ces pickling thiab degreasing, thiab rov kub dov thiab calendering ntawm qhov kub siab tshaj 800 ° C.

3.HTE, kub kub elongation electro deposited tooj liab ntawv ci, yog ib tug tooj liab ntawv ci uas tuav zoo heev elongation ntawm kub (180 ℃). Ntawm lawv, qhov elongation ntawm 35μm thiab 70μm tuab tooj liab ntawv ci ntawm qhov kub siab (180 ℃) yuav tsum tau khaws cia ntawm ntau tshaj 30% ntawm elongation ntawm chav tsev kub. Nws tseem hu ua HD tooj liab ntawv nyiaj (siab ductility tooj liab ntawv ci).

4.RTF, Rov qab kho tooj liab ntawv ci, tseem hu ua rov qab tooj liab ntawv ci, txhim kho adhesion thiab txo roughness los ntawm kev ntxiv ib qho tshwj xeeb cob txheej rau ntawm glossy nto ntawm electrolytic tooj liab ntawv ci. Qhov roughness feem ntau yog nyob nruab nrab ntawm 2-4um. Sab ntawm cov ntawv ci tooj liab txuas nrog rau cov txheej txheej resin muaj qhov tsis tshua muaj roughness, thaum lub sab ntxhib ntawm cov ntawv ci tooj liab sab nraud. Qhov qis tooj liab ntawv roughness ntawm lub laminate yog heev pab tau rau ua zoo Circuit Court qauv ntawm lub puab txheej, thiab cov ntxhib sab kom adhesion. Thaum qhov tsawg roughness nto yog siv rau high-frequency signals, hluav taws xob kev ua tau zoo heev.

5.DST, ob sab kev kho mob tooj liab ntawv ci, roughening ob qho tib si du thiab ntxhib nto. Lub hom phiaj tseem ceeb yog txo cov nqi thiab txuag cov tooj liab saum npoo kev kho mob thiab cov kauj ruam browning ua ntej lamination. Qhov tsis zoo yog qhov tooj liab nto tsis tuaj yeem khawb, thiab nws nyuaj rau tshem tawm cov kab mob thaum nws kis kab mob. Daim ntawv thov yog maj mam txo.

6.LP, qis profile tooj liab ntawv ci. Lwm cov tooj liab foils nrog qis profile muaj xws li VLP tooj liab ntawv nyiaj (Cov ntawv nyiaj qis heev), HVLP tooj liab ntawv nyiaj (High Volume Low Pressure), HVLP2, thiab lwm yam. Cov pob zeb uas tsis tshua muaj tooj liab ntawv ci yog zoo heev (hauv qab 2μm), equiaxed nplej, tsis muaj columnar siv lead ua, thiab yog lamellar crystals nrog cov npoo tiaj, uas yog qhov zoo rau kev xa cov teeb liab.

7.RCC, resin coated copper foil, tseem hu ua resin tooj liab ntawv ci, nplaum-rov qab tooj liab ntawv ci. Nws yog nyias electrolytic tooj liab ntawv ci (thickness feem ntau yog ≦18μm) nrog ib los yog ob txheej ntawm cov kua nplaum tshwj xeeb (cov khoom tseem ceeb ntawm cov resin feem ntau yog epoxy resin) coated rau ntawm qhov chaw roughened, thiab cov hnyav raug tshem tawm los ntawm ziab hauv lub qhov cub, thiab cov resin dhau los ua ib theem B-kho.

8.UTF, ultra nyias tooj liab ntawv ci, hais txog tooj liab ntawv ci nrog lub thickness tsawg dua 12μm. Qhov ntau tshaj plaws yog tooj liab ntawv hauv qab 9μm, uas yog siv nyob rau hauv kev tsim cov ntawv luam tawm Circuit Court boards nrog zoo circuits thiab feem ntau yog kev txhawb nqa los ntawm cov cab kuj.
High quality copper foil thov hu rauinfo@cnzhj.com


Lub sij hawm xa tuaj: Sep-18-2024